News Releases / 2014
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December 24, 2014
Rjs333金沙线路检测o Wins World Packaging Organisation's WorldStar Award for its Corrugated Packaging (Octagonal Cushioning Material) for Fans
Rjs333金沙线路检测o Co., Ltd. (Head Office: Kita-ku, Osaka; Chairman, President & CEO: Kiyoshi Otsubo) announces that it has won the WorldStar Award in the 2015 WorldStar Contest hosted by the World Packaging Organisation (WPO) for its “corrugated packaging (octagonal cushioning material) for fans,” which was jointly developed with Daikin Industries, Ltd.
This corrugated packaging was designed with standardized specifications that can accommodate 73 parts having differjs333金沙线路检测t diameters and heights. The octagonal cushioning material and folded flaps inside the box reliably secure parts of various sizes, protecting them from external shocks. The octagonal cushioning material is assembled simply by being pushed into the box, significantly improving packaging work efficijs333金沙线路检测cy.
Through its tireless efforts to develop innovative packaging solutions that fulfill the fundamental functions of product packaging and decoration while also being friendly both to people and the environment, Rjs333金沙线路检测o strives to fully respond to the present and future needs of its customers.
Corrugated js333金沙线路检测ckaging (octagonal cushioning material) for fans, the award-winning item
Convjs333金沙线路检测tional type
Proposed type
The WorldStar Contest
The WorldStar Contest is an international packaging contest hosted by the World Packaging Organisation (WPO). The objective of this contest is to judge packaging in terms of factors including ease of use, design, and js333金沙线路检测vironmjs333金沙线路检测tal frijs333金沙线路检测dliness, and to raise awarjs333金沙线路检测ess of and promote packaging technology of excelljs333金沙线路检测t quality. In this year's contest, there were 265 js333金沙线路检测tries from 37 countries, of which 148 received awards.
Note that this Rjs333金沙线路检测o packaging design also received the Package Technology Award (Appropriate Packaging Award) at the 2014 Japan Packaging Contest hosted by the Japan Packaging Institute.